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Computer system design

Embedded control system design


Custom Electrical Engineering

 

U.S. Patent 5,353,431
Memory address decoder with storage for memory attribute information

Abstract
A programmable and testable memory address decoder for a computer system where a static random access memory device is used to store memory configuration information. The computer system includes a processor which is coupled to the memory address decoder via data and address lines. The memory address decoder includes an SRAM for storing a memory map which associates memory attributes with memory ranges or blocks of memory. The memory attributes include: memory residence, caching, write protection of memory ranges, and the decoding of other
memory modules. The present invention also includes control logic, a read-back register, and a mode register for controlling the loading and read back verification of the SRAM. The control logic operates the memory address decoder in one of four modes. These modes include: 1) power-up mode, 2) programming mode, 3) read back mode, and 4) normal operation mode. One of these modes is selected by loading the mode register with a value corresponding to the desired mode. A default power up mode is entered after power is first applied to the computer system. When the processor specifies a programming mode, the processor may write data directly into the SRAM. When the processor specifies the read back mode, the contents of the SRAM may be read back by the processor through
the read back register. A normal mode may be entered in order to enable access to system memory (DRAM) with memory attribute information.

Inventors: Doyle; Patrick F. (Hillsboro, OR); Cross; Leonard W.
(Beaverton, OR); Noar; Roger (Tigard, OR)
Assignee: Intel Corporation (Santa Clara, CA)
Appl. No.: 193516
Filed: February 8, 1994


U.S. Patent 6,118,669

Routing topology for identical connector point layouts on primary and secondary sides of a substrate

Abstract
Under one aspect of the invention, the invention includes a multilayered substrate. The substrate includes a primary side having a first group of connection points, including a first connection point, having a first layout to interface with a first chip. The substrate also includes a secondary side having a second group of connection points, including a second connection point, having a layout identical to the first layout, to interface with a second chip. The substrate also includes an intermediate connection point coupled to the first and second connection points through first and second branch traces each having substantially the same electrical length.

Inventors: Yee; Dawson L. (Beaverton, OR); Noar; Earl Roger (Lacey, WA)
Assignee: Intel Corporation (Santa Clara, CA)
Appl. No.: 023388
Filed: February 13, 1998

   

 

 

 

 

 

 

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