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About Rayonics |
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Computer system design
Embedded control system design
Custom Electrical Engineering |
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U.S. Patent
5,353,431
Memory address decoder with storage for memory attribute
information
Abstract
A programmable and testable memory address decoder for a
computer system where a static random access memory device is
used to store memory configuration information. The computer
system includes a processor which is coupled to the memory
address decoder via data and address lines. The memory address
decoder includes an SRAM for storing a memory map which
associates memory attributes with memory ranges or blocks of
memory. The memory attributes include: memory residence,
caching, write protection of memory ranges, and the decoding
of other
memory modules. The present invention also includes control
logic, a read-back register, and a mode register for
controlling the loading and read back verification of the
SRAM. The control logic operates the memory address decoder in
one of four modes. These modes include: 1) power-up mode, 2)
programming mode, 3) read back mode, and 4) normal operation
mode. One of these modes is selected by loading the mode
register with a value corresponding to the desired mode. A
default power up mode is entered after power is first applied
to the computer system. When the processor specifies a
programming mode, the processor may write data directly into
the SRAM. When the processor specifies the read back mode, the
contents of the SRAM may be read back by the processor through
the read back register. A normal mode may be entered in order
to enable access to system memory (DRAM) with memory attribute
information.
Inventors: Doyle; Patrick F. (Hillsboro, OR); Cross; Leonard
W.
(Beaverton, OR); Noar; Roger (Tigard, OR)
Assignee: Intel Corporation (Santa Clara, CA)
Appl. No.: 193516
Filed: February 8, 1994 |
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Routing topology for identical connector point
layouts on primary and secondary sides of a substrate
Abstract
Under one aspect of the invention, the invention includes a
multilayered substrate. The substrate includes a primary side having
a first group of connection points, including a first connection
point, having a first layout to interface with a first chip. The
substrate also includes a secondary side having a second group of
connection points, including a second connection point, having a
layout identical to the first layout, to interface with a second
chip. The substrate also includes an intermediate connection point
coupled to the first and second connection points through first and
second branch traces each having substantially the same electrical
length.
Inventors: Yee; Dawson L. (Beaverton, OR); Noar; Earl Roger (Lacey,
WA)
Assignee: Intel Corporation (Santa Clara, CA)
Appl. No.: 023388
Filed: February 13, 1998
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